HB 720 Spray
Advantages and equipment features
If materials have to be bonded together over a large area, the spray version is selected. With the spray version of the HB 720, different spray applications patterns can be realised.
- Wafer-thin spray film and thus lower consumption of hot-melt adhesive
- Process reliability through a consistent spray pattern
- Large-area application
Specifications
Application Areas
Description
- Hot melt applicator with electronic temperature control and automatic lowering
- Fill level indicator
- Very high melting capacity
- Incl. cone nozzle standard Ø 1.5 mm
- Microprocessor-controlled, infinitely adjustable temperature control +/- 1 °C
- One-hand bayonet lock for optimal ease of use
- Ergonomically-shaped handle for fatigue-free working
- Automatic temperature-lowering mechanism for economic energy consumption on the one hand and protection of the hot melt adhesive on the other
- Temperature control with digital display integrated in the handle