Glossary

A

• Adhesion
• Adhesion failure
• Adhesive
• Application
  
  • Bead application
  • Dot application
  • Intermittent application
  • Line application
  • Spray application
  • Surface application
• Application head

B

• Bead nozzles
• Bond strength
• Bonding
• Bonding surface
• Burns, Treatment
• Bypass valve

C

• Capillary
• Coating weight
• Cohesion
• Cohesion failure
• Contact pressure
• Cooling Behaviour
• Cracking

D / E

• Delivery Form
• EVA

F

• FeCuNi
• Flow rate
• Fracture of bonded parts
• Fracture pattern

G

• Gear pump

H

• Handgun
• Heating cartridge
• Heated hoses
• High viscosity
• Hot tack
• Hot melt adhesive
• Hot Melt Glue Gun

I

• Industrial glue
• Initiator
• Initial strength
• Inert gas
• Intermittent hot melt application
• Isocyanate

J

• Joining

K / L

• Low-temperature flexibility
• Low-viscosity

M

• Melting capacity
• MDI – methylene diphenyl isocyanate
• Module
• Multi-channel controller

N

• Ni120
• Non-stick coating
• Nozzle
  
  • Bead Nozzle
  • Spray Nozzle
• NTC

O

• Open time
• Over-temperature protection

P

• PA
• Parent machine
• Pattern control system
• PID controller
• PO
• POR
• Positive Temperature Coefficient (PTC)
• PSA
• PT 100
• PUR
• Plasticisers
• Piston pump
• Power consumption P max

Q / R

• Reactive hot melt adhesive
• Release Liner
• Restoring Force
• Return module
• Rotary pulse encoder

S

• Safety valve
• Setting time
• Shore hardness
• Softening point
• Solenoid valve
• Surface treatment
• Surface tension
• Substrate
• Substrate failure
• Supply voltage
• Swivel application head

T

• Temperature controller
• Temperature lock
• Temperature reduction
• Temperature sensor
• Thermal endurance
• Threads
• Three-Phase AC motor
• TPE

U / V

• Viscosity

W

• Wetting

X / Y / Z