Polyamide adhesive C0874 / C0874S
Advantages and equipment features
Low pressure injection moulding of electrical components and plug forms. Securing of electrical components on printed circuit boards, as well as enamelled wires on spools. Also available in black.
- Sticks and granules in two colours
- Good thermal stability and elasticity
- Good adhesion on soft PVC
- Excellent cold stability (down to -30 °C)
Specifications
Adhesive basis
Polyamide
Delivery Forms
Granules, sticks
Processing temperature
180 - 210° C
Application Areas
Description
Note: Slight colour variations may occur with adhesives, depending on the raw materials and processes used.
The hot-melt adhesive has good flexibility and plasticiser resistance.
Good thermal stability, good cold flexibility. Adhesion: Excellent adhesion to wood, paper, leather, ABS, PVC, PC, soft PVC and PU foam.
The hot-melt adhesive has the UL94V-2 test certificate.
| Type | Basis | Delivery form | Appropriate application techniques |
| C20874 | Polyamide | Sticks, Ø ca.12 mm | Mechanical glue guns |
| C20874 (black) | Polyamide | Sticks, Ø ca.12 mm | Mechanical glue guns |
| C40874 | Polyamide | Granules | Pneumatic glue guns, melters |
| C40874 (black) | Polyamide | Granules | Pneumatic glue guns, melters |
Hot Melt Glue Gun HB 250
HB 710 Bead HT (High Temperature)
