Thermal endurance

The term stands for the temperature resistance of a bond. It is influenced by the ambient temperature and the forces acting on the connection.  

Hot melt adhesives and heat

Bondings with hot melt adhesives are soluble by heat and recoverable, as the internal strength (cohesion) of the adhesive decreases at elevated temperatures.  This heat can be caused by the ambient temperature or permanent stress by mechanical forces.

The thermal stability of a bond can be increased by the use of reactive hot melt adhesives.